IBM develops way to keep chips cooler

US based tech giant IBM has said that their Zurich Research Laboratory has developed a glue-application technique that can be used to keep chips running cooler.

The microprocessors are glued with cooling elements which releases heat and keeps the processors cool while operating.

The company said that current gluing technologies continue to be an obstacle to efficient heat dissipation. The researchers who worked on this new technique discovered that the problem with current techniques lies in how the glue is applied.

IBM’s researchers have developed tiny channels in the base of the heatsink which would help in keeping the glue to flow properly.

The researchers claim that this would improve the heat dispersion three times more effectively compared to current processes. The company has however not said on how soon they plan to start using this new way of gluing chips to cooling elements.