Via Technologies developing really small motherboards

Via Technologies developing really small motherboards

Via Technologies has announced that they are going to develop even smaller motherboard products to enable the development of smaller computing devices.

The company aims to develop motherboards that are even smaller than their business card-sized Mobile ITX product.

Wenchi Chen, Via’s CEO said in a statement: “In another year or two we will come out with even smaller form factors.”

Via’s just launched Mobile ITX board measures just around 7.5 centimeters by 4.5 cm. The company believes that integration of several components in the coming future would enable them to further shrink the size of the motherboard.

Via is a smaller player in the microprocessor market but has find a good demand for their customized solutions for smaller computing products. Samsung is one of their most high profile customers and uses their chips in their Q1 ultramobile PC. HP is also using Via products for their cheap computers available in China.